| 摘要 |
PURPOSE:To enable that a probe is brought into contact with all pads even for a multi-pin device by providing a measuring probe group for each chip at the interval of two pitches or more. CONSTITUTION:Holes 12-15 for one chip are opened at each vertex of a square the edge of which is nearly equal to the radius of a wafer at the position of the symmetrical points of a probe card 4 and probes 3 for one chip are provided around these holes. If a group of the probes for one chip is placed at each vertex 12-19 of two squares the edge of which is nearly equal to the radius of a wafer moved in one direction so that each edge is made equal interval, the total area of the wafer can be covered by the range of the movement of the wafer 1/(4X2). In general, if placed at each vertex of n squares, the total area of the wafer can be covered by the range of movement of the wafer 1/4n and a time of measurement can be reduced. |
