发明名称 METHOD FOR MEASURING FILM THICKNESS OF INTER-LAYER INSULATING LAYER OF MULTI-LAYER WIRED SUBSTRATE
摘要 PURPOSE:To execute the non-destructive and average measurement of film thickness by measuring capacity between the 2nd and 3rd reference patterns. CONSTITUTION:The 1st reference pattern 3 is formed in the 1st conductive layer and the 2nd reference pattern 7 opposed to the 1st pattern 3 with a prescribed area is formed in the 2nd conductive layer through an insulating layer 4. The 3rd reference pattern 8 electrically connected to the 1st reference pattern 3 is formed in the 2nd conductive layer and the film thickness of the insulating layer can be found out by measuring the capacity between the 2nd and 3rd reference patterns 7, 8. Consequently, the average film thickness of inter-layer insulating layer can be found out non-destructively.
申请公布号 JPS6170403(A) 申请公布日期 1986.04.11
申请号 JP19840191809 申请日期 1984.09.14
申请人 TOSHIBA CORP 发明人 IYOGI YASUSHI
分类号 H05K3/46;G01B7/06;H05K3/00 主分类号 H05K3/46
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