| 摘要 |
PURPOSE:To mount chips with high density by pairing two frames, each loading the chips on these frames and sealing the chips by a single molding section so that the frames are not brought into contact mutually electrically. CONSTITUTION:A first frame 2 on which a chip 1 is loaded and a second frame 4 on which a chip 3 is loaded are laminated by insulating adhesives, and inner lead sections for the first and second frames 2, 4 are sealed by a single mold 5. Outer lead sections for the first frame 2 and outer lead sections for the second frame 3 are arranged alternately and are not brought into contact mutually electrically. Accordingly, an LSI can be brought to a hybrid state without changing the size of a package, two packages need not be prepared, and trouble on a wiring on mounting and trouble on a space are also eliminated. A CPU and a DMA controller, etc. can also be coupled organically, thus resulting in no elevation of manufacturing cost. |
