| 摘要 |
A wire bonding apparatus, such as used frequently for assembling electronic parts, is designed to prevent a physicochemical reaction, which leads to defects in a wire bonding operation, from occurring between a bonding wire and a wire connecting tool so that fusion of the bonding wire to the wire connecting tool does not occur. The material of the connecting tool 13A is a substance which does not easily generate a physicochemical reaction with the bonding wire, and covering at least the region of the wire connecting tool 13A which contacts the bonding wire is a film 53 of a material which does not easily generate a physicochemical reaction with the bonding wire. <IMAGE> |
