| 摘要 |
PURPOSE:To shorten the treating time for performing an etching on one surface of a tabular body by stirring strongly the treating liquid and to enable to perform a uniform treatment on the one surface of the tabular body by a method wherein the tabular body and the holding unit for the tabular body are made to rotate. CONSTITUTION:A motor 3 is made to rotate and a wafer holding unit 2 is made to rotate by a belt 4. One surface of a wafer 1 is always made to come into contact to a fresh etching liquid 6. A stirring device, which is used for performing a treatment on the one surface of the wafer 1 with the etching liquid 6 according to a stirring of the etching liquid 6 and a blowoff of N2 gas, is unnecessary and the one surface of the wafer 1 is uniformly etched. According to this way, the deterioration of the etching liquid and contamination by the etching liquid are little and the material saving of chemicals for the treatment is contrived, and at the same time, it is decreased for the wafer to be contaminated and the yield of wafer products is improved. |
