| 摘要 |
PURPOSE:To perform an irradiation process uniformly on the whole surface of the material to be processed by a method wherein a linear energy beam is made to irradiate on the material to be processed located on a rotating stand through an irradiation region controlling means, and the shifting operation of the material to be processed is repeated through the intermediary of an irradiation region shifting means. CONSTITUTION:Clutches CL1-CL4 are coupled to the movable screws 36, 37, 46 and 47 of X-Y stages 33 and 43 in such a manner that a linear electron beam is made to irradiate on the center of wafers 11-44, and the X-Y stages 33 and 43 are driven in such a manner that the centers of the wafers 11-14 are positioned directly below the four windows 22 of a beam mask 21. The clutches CL1-CL4 are separated with each other, a turn table 2 is rotated at a constant speed, and an electron beam is made to irradiate. At this time, the source of beam is rotated by a motor in such a manner that the longitudinal direction of the beam is brought in the state wherein it is in parallel with the straight line linking the center of the wafer and the center of the turn table. When the first irradiation is finished, the turn table is stopped, the clutches CL1-CL4 are coupled, and after X-Y stages 33 and 34 are shifted, an electron beam is made to irradiate. The beam is uniformly made to irradiate the whole surface by repeating the above-mentioned procedures. |
