| 摘要 |
PURPOSE:To detect defects proper to chips to be inspected, by a method wherein the circuit pattern of a chip to be inspected is photo-irradiated, and the circuit pattern serving as the model is prepared out of an image obtained by detecting the scattering light; then, this pattern is compared with the circuit pattern of the chip to be inspected. CONSTITUTION:When illuminating one point of an LSI chip 1, a photoelectric converter 17 detects the scattering light from the circuit pattern of the chip 1 via objective lens 13.Next, the converter 17 detects the scattering light from the circuit pattern of the chip 2 via objective lens 13. A comparing judgement unit 25 inspects the circuit patterns of the chips 1 and 2 by comparison. A defective co-ordination table 5 inputs the signals related with defects coming from the comparison-judgement unit 25. This action enables the detection of defects proper to chips to be inspected. |
