| 摘要 |
PURPOSE:To improve remarkablly property, yield and reliability by a method wherein a section contacting to a semiconductive element and a sieve-state groove at outside thereof are provided on the semiconductive element mounting section of a lead-frame and the semiconductive element is adhered by solder or wax at almost center of the sieve-state groove. CONSTITUTION:A lead-frame 11 is formed to unite plural groups consisting of a lead, which deduces an electrode by punching a metallic plate, and an island 11', which adheres wit a semiconductor chip 12, in one body by a fixed plate 19. On the island 11', the face, which is contacted wit the semiconductor chip 12, and at the outside thereof the groove 17 is formed in sieve-state for the purpose of soldering getaway and improvement sticking at the time of resinous sealing. A solder 13 is mounted on a center section of the sieve-state groove 17 and thereon the mesa-type or the planar-type semiconductor chip 12 is mounted. After that, the semiconductor chip 12 is adhered to he island 11' with groove 17 by means that the proper load is imposed on the semiconduc tor chip 12. |
