| 摘要 |
<p>PURPOSE:To improve manufacturing efficiency by loading to a case a hollow pipe which communicates with the interior and exterior of said case and closing said hollow pipe after exhausting the air in the case to the outside through said hollow pipe while a pack mold is sealed by heating. CONSTITUTION:An aperture 101 is provided to the one side surface of a resin case 1, an electronic part element 2 such as a ceramic filter, etc. is inserted through this aperture 101. Thereafter, a pack mold 3 is loaded to the aperture 101 and this aperture 101 is sealed by heat processing. In this case, the lead terminals 202-204 of element 2 are formed as the hollow pipes having the hole 205, these are arranged so that the hole 205 is communicating with interior and exterior of the case through the mold 3. Thereby, when the mold 3 is sealed by heating, the air in the case 1 is exhausted to the outside through the pipes 202-204 and the hole 205 is closed after pack mold processing.</p> |
