| 摘要 |
A material of high thermal conductivity for insulating electronic parts is produced by subjecting the compound, which contains from 50 to 95% by volume of thermally conductive, inorganic powder and from 5 to 50% by volume of binder, to a compression shear force, where the binder contains at least 0.2 to 30% by volume, preferably from 1.0 to 20% by volume, of polytetrafluoroethylene (PTFE) and contains a synthetic rubber, the volume ratio of rubber being at least a quarter or more of the PTFE, and the compression shear force defibrating the PTFE and dispersing the inorganic powder in such a way that a uniform distribution of thermally conductive material takes place; it is also possible to add other additives, such as vulcanising agents, vulcanisation accelerators, stabilisers, processing assistants, flameproofing agents, colorants and solvents, and to reinforce the material using woven or nonwoven fabrics or staple fibres.
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