发明名称 THICK FILM CIRCUIT BOARD
摘要 A thick film circuit board comprises at least parts of SiC substrate at which a thick film resistor is provided being coated with a glass layer having a good adhesion to the SiC substrate and the same or similar coefficient of thermal expansion as or to that of the SiC substrate, and no swelling, cracking and peeling appear on the thick film resistor and no electroconductive component is formed on laser-trimmed parts of the thick film resistor.
申请公布号 EP0115638(A3) 申请公布日期 1986.03.26
申请号 EP19830113187 申请日期 1983.12.28
申请人 HITACHI, LTD. 发明人 SUGISHITA, NOBUYUKI;SUZUKI, HIDEO;OHKOHCHI, TAKAHIKO
分类号 H05K1/16;H01L23/15;H01L27/01;H05K1/03;H05K1/09;H05K3/38 主分类号 H05K1/16
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