发明名称 |
THICK FILM CIRCUIT BOARD |
摘要 |
A thick film circuit board comprises at least parts of SiC substrate at which a thick film resistor is provided being coated with a glass layer having a good adhesion to the SiC substrate and the same or similar coefficient of thermal expansion as or to that of the SiC substrate, and no swelling, cracking and peeling appear on the thick film resistor and no electroconductive component is formed on laser-trimmed parts of the thick film resistor. |
申请公布号 |
EP0115638(A3) |
申请公布日期 |
1986.03.26 |
申请号 |
EP19830113187 |
申请日期 |
1983.12.28 |
申请人 |
HITACHI, LTD. |
发明人 |
SUGISHITA, NOBUYUKI;SUZUKI, HIDEO;OHKOHCHI, TAKAHIKO |
分类号 |
H05K1/16;H01L23/15;H01L27/01;H05K1/03;H05K1/09;H05K3/38 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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