| 摘要 |
PURPOSE:To mount a chip on a substrate at high speed and in a highly precise manner by a method wherein an adhesive agent is dispersed on the prescribed position of a circuit substrate in a highly precise manner, and a semiconductor chip is fixed thereon. CONSTITUTION:A semiconductor chip supply part 5 and a circuit substrate supply part 4 are arranged on the upper surface of a mounting device pinching rotary conveying device 16, and a semiconductor chip is mounted on a circuit substrate B. According to this contitution, a tray stocker 14 whereon a number of trays 13 are placed is provided on a chip supply part 5, the pellet in the tray 13 is picked up by the pick-up head 15 provided on the arm 19 of the robot 18 which is installed on a base stand 17, and a position correcting table 20 and a conveying table 21, which rotates intermittently, are positioned on a rotary conveying device 16. Then, the substrate B is shifted on the loader 11a of the substrate supply part 4, an adhesive agent is coated on the substrate B using the head 2 having a television camera 25a and a dispense head 24, a chip is fixed using a mount head 3 having television camera 25b and a mount head 36, and a series of these operations are monitored by a monitoring television 27. |
