| 摘要 |
PURPOSE:To prevent the failure of short of a lead frame with the connection wirings among internal elements in semiconductor of leads by arranging projections continuously to a projection electrode, in a part of internal element side on a surface of the projection electrode formed on a main surface. CONSTITUTION:On a semiconductor chip 7, an insulating film 6, a barrier metal 8, a projection electrode 1, internal elements connecting wiring 2 and a projection electrode leading wiring 12 are formed. The projection electrode 9 is arranged continuously to the electrode 1 on a part of internal element side on a surface of the electrode 1. Even if the relative position of a lead frame for the electrode 1 of the lead 3 slips toward the internal element side of the chip 7 at connection, in the chip 7 after connection, the lead 3 does not fall downward by virtue of the electrode 9 and the ailure of short between the lead 3 and the wiring 2 can be prevented. Also, there is no possibility that the lead 3 pushes an insulating film 5 aside and causes the insulation failure. |
