发明名称 |
Electroconductive molybdenum paste |
摘要 |
An electroconductive molybdenum paste comprising 100 parts by weight of a mixture consisting of 68.0 to 89.2% by weight of molybdenum powders having an average particle size of 0.5 to 10 mu m, 10.0 to 27.0% by weight of a solvent, and 0.8 to 5.0% by weight of a binder, 0.5 to 5.0 parts by weight of a gelling agent, and 0.5 to 4.0 parts by weight of a silane coupling agent can firmly fill throughholes of a green sheet without formation of clearances and hollows in the resulting conductors in the throughholes, with better surface roughness of the conductor surfaces in the throughholes, and without development of cracks near the throughholes.
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申请公布号 |
US4576735(A) |
申请公布日期 |
1986.03.18 |
申请号 |
US19840660089 |
申请日期 |
1984.10.12 |
申请人 |
HITACHI, LTD. |
发明人 |
KUROKI, TAKASHI;FUJITA, TSUYOSHI;TODA, GYOZO;ISHIHARA, SHOUSAKU;OHZAWA, YOSHIYUKI |
分类号 |
C04B41/51;C04B41/88;H01B1/22;H05K1/09;H05K3/40;(IPC1-7):H01B1/02 |
主分类号 |
C04B41/51 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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