| 摘要 |
PURPOSE:To reduce thermal resistance of high output semiconductor element when it is operating and mount high output semiconductor devices to LCC package with high packing density by providing excellent thermal conductivity at the bottom part of package. CONSTITUTION:A ceramic frame 1 is formed as a package body and a bottom plate 4 is exposed from the lower surface of package. This bottom plate 4 is formed with a material having thermal matching with ceramics and high thermal conductivity. A semiconductor chip 5 is attached to the bottom plate 4 and the electrode of this chip 5 is connected to the wiring 2 of vertical groove 3 provided at the side surface of frame 1 with the wire 6. A cover 7 is provided at the upper surface of frame 1 mounting this chip 5 and the chip 5 is sealed to the package. A high output semicondutor device is mounted with high packing density of the LCC package by improving thermal conductivity of bottom plae 4 and reducing thermal resistance of high output semiconductor element when it is operating. |
