| 摘要 |
PURPOSE:To prevent undesired contact with flow of wire and eliminate restriction on layout by connecting a semiconductor chip and inner lead with a wire material coated with insulator. CONSTITUTION:An Au lead 2 coated with resin 3 is held to a capillary 1 of a bonding apparatus. This capillary 1 is moved donward to the position of terminal 6 of semiconductor chip 5 attached on the tab 4 and a gold ball 2a and terminal 6 are bonded. Next, the capillary 1 is moved to the specified position on the inner lead 11 and is then moved downward. The coating at the contact surface with Au lead 2 is fused by thermal bonding and application of ultrasonic wave and thereby a part of Au lead 2 and the specified position of lead 11 are bonded by a hydrogen torch. When the wire is bonded to many terminals 6 of semiconductor chip 5, unwanted contact due to flow of wire can be prevented by the coating 3 and restriction on layout can be eliminated. |
