摘要 |
PURPOSE:To mount a semiconductor element directly to printed circuit board, and to mechanize wiring work by forming a refrigerant flow path between the printed circuit board for mounting parts and the printed circuit board for a pattern and communicating an inlet and an outlet for a refrigerant in the semiconductor element. CONSTITUTION:A refrigerant flow 13 is formed by a printed circuit board 10 for mounting parts, a printed circuit board 11 for a pattern and a guide plate 12. A semiconductor element 14 is fitted directly to the printed circuit board 10 for mounting parts, and wired by the printed circuit board 11 for the pattern. A refrigerant introducing port 15 and a refrigerant lead-out port 16 for the semiconductor element 14 are communicated with the refrigerant flow path 13. Wiring work can be mechanized, thus improving the efficiency and reliability of wiring work. A cooling plate can be unnecessitated, thus allowing miniaturization and lightening. |