发明名称 RESIN SEALING MOLD DEVICE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent generation of contraction voids in a resin sealed body, improve the quality and furthermore, improve yield in sealing resin by reducing pressure drop in a runner for the sealing resin and pressing and filling the resin into each cavity group under substantially uniform pressure and the same condition. CONSTITUTION:In the first type, main runners 30 are provided radially to the periphery from a pot 29 and three or more first mold blocks 31 are provided radially to the direction of the main runner. In these first mold blocks 31 are formed distributed runners 32 communicating with each other and cavities 34 at a plurality of branched places. Furthermore, in the second type, a chamber 5 is disposed and three or more second mold blocks 24 are radially disposed to form a plurality of cavities 25. Each main runner 30 has the same length and is linearly made to communicate with the distributed runner 32 at short intervals. The filling of resin into each cavity group is carried out with little pressure drop and under the same condition.
申请公布号 JPS6148925(A) 申请公布日期 1986.03.10
申请号 JP19840171107 申请日期 1984.08.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 YANAGIYA KOJI
分类号 H01L21/56;B29C45/27;B29C45/32;B29K105/22;B29L31/34 主分类号 H01L21/56
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