| 摘要 |
According to this method for three-dimensional expansion of the electrically conductive connections between the connecting contacts (2) of large-scale integrated electronic components, especially of semiconductor circuits which are arranged especially in flat-pack housings (1), and the contact points of an electrical connecting device on a component carrier (5), the connecting contacts (2) are arranged in a three-dimensional manner on the housing (1) or are aligned with respect to a connecting device on a component carrier (5) in such a manner that the connecting points of the individual connecting contacts (2) to the contacts of the connecting device are arranged in a distributed manner on the component and/or on the component carrier (5) on at least two contact point planes which run one above the other. <IMAGE> |
