| 摘要 |
PURPOSE:To dry up wafers completely by means of discharging any liquid content permeated into the bottom of grooves by a method wherein the wafers are held not in parallel with a rotary plane. CONSTITUTION:Any liquid content adhering to wafers held on main surfaces 3a rotating outside formed of the pattern of drier is discharged out of the surfaces 3a by centrifugal force generated by a rotating axle 1. At this time, the main surfaces 3a are held meeting the radial direction of rotary circle of rorating axle 1 at almost right angle while carbed into grooves 3b at right angle in the radial direction. In such a process, the liquid content permeated into the bottom of grooves 3b is energized with centrifugal force in the normal (perpendicular) direction to be linearly discharged out of the grooves 3b turning outside. In the other process, the main surfaces 3a are held in parallel with the center of rotation making the grooves 3b normal of the center of rotation perfectly turning outside to discharge the liquid content permetated into the bottom thereof. |
