发明名称 |
ELECTRONIC CHIP CARRIER HEAT SINK UNIT |
摘要 |
Dissipation of heat from a socketed leadless electronic chip- carrier package 7 is promoted by a heat-conducting metal socket cap 6 of a unitary construction which both mechanically holds the package 7 securely mated with a multi-pin socket 8 and also cools the package by way of an integrated array of heat-radiating elements 6H, 6I, 6J and 6K. Edge clasping of the cap 6 with the socket 8 avoids interference with conduction of heat away from central areas of the package and cap. <IMAGE> |
申请公布号 |
JPS6143454(A) |
申请公布日期 |
1986.03.03 |
申请号 |
JP19840234857 |
申请日期 |
1984.11.07 |
申请人 |
AABITSUDO ENG INC |
发明人 |
FUIRITSUPU EE JIYONSON;ARUFURETSUDO EFU MATSUKAASHII |
分类号 |
H01L23/36;H01L23/40;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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