发明名称 COOLING METHOD FOR THIN FILM FORMING DEVICE
摘要 PURPOSE:To prevent the temperature of the reaction chamber forming members from dropping lower than a zero point by a method wherein the flow rate of cooling water, which is flowed in the interiors of the forming members, is made to reduce or is dwindled into zero for the prescribed time before and after the reaction chamber forming members are displaced for opening and shutting the reaction chamber. CONSTITUTION:The prescribed amount of cooling water is flowed in a conducting path 10 by a cooling water feeding unit 13 and the valve 14 of a piping system 15 is held being shutted in a state that belljars 1 and 2 are displaced for releasing a reaction chamber 9 and for several minutes before and after the belljars 1 and 2 are made to displace. When the chamber 9 is shutted and the thin film is formed, the abnormal overheating of the reaction chamber forming members is prevented with the cooling water, which is flowed in the path 10, the feed of cooling water is reduced or is dwindled into zero for several minutes before and after the reaction chamber is released and the temperature of the belljars 1 and 2 and a substratum 8 never drop lower than a temperature, at which water content in the atmosphere is bedewed. Accordingly, water content is prevented from condensation to the inner wall and the components of the chamber, thereby enabling to form the stable and good quality of thin film.
申请公布号 JPS6140023(A) 申请公布日期 1986.02.26
申请号 JP19840160630 申请日期 1984.07.31
申请人 TOSHIBA MACH CO LTD 发明人 GOTO TAISAN
分类号 H01L21/205;C23C16/44;C23C16/52;H01L21/302;H01L21/3065;H01L21/31 主分类号 H01L21/205
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