| 摘要 |
PURPOSE:To enable to push out surely a formed resin from a bottom force without necessitating troublesome adjusting work, and without damaging the bottom force at a resin seal forming device for semiconductor by a method wherein a push-down device to push down an ejector plate in relation to a bottom platen is equipped to the ejector plate of the bottom force. CONSTITUTION:A lead frame is arranged on a bottom force 15 placed in a descended position, and a bottom force mount 52 is ascended. At this time, an eject cylinder 58 constructing a push-down device is operated to push down an ejector plate 53 in relation to a bottom platen 50 by the prescribed pushing out size (alpha), and the top edges of respective eject pins 34 are made to be positioned at the bottoms of respective cavities 30. When resin sealed bodies are formed, and heated to be hardened, the mount 52 is descended to separate the bottom force 15 from a top force 14. When the mount 52 reaches a dead point, pushing down action of the cylinder 58 is released. thereupon the ejector plate 53 approaches and returns in relation to the bottom platen 50 by size (alpha) according to pressure of a compression spring 55. Accordingly, the top edges of the respective eject pins are protruded in the respective cavities 30, and the respective resin sealed bodies are pushed out together with the lead frame formed in one body. |
