| 摘要 |
PURPOSE:To accelerate a wire bonding process by a method wherein a bonding position of wire bonding process is located in terms of a position slip computed within a mounting process. CONSTITUTION:Within a mounting process, a mounting position of a semiconductor chip 7 is picked up by a television camera 9 while the binary systemized signals of pick-up image output are checked up with the reference pattern to compute a position slip and then an actual semiconductor chip mounting position is located in terms of the position slip to bond the semiconductor chip 7 on a circuit substrate. After this process, the bonding position may be automatically detected by means of picking up the image thereof utilizing another television camera 12 mounted on a bonding head 11 in terms of a position slip between the binary systemized signals of pick-up image output and said mounting position. The wire bonding process may be performed by means of driving the bonding head 11 on the detected bonding position in the directions of X, Y and Z axes. |
