发明名称 RESIN COMPOSITION, LAMINATE, AND THEIR PREPARATION
摘要 <p>PURPOSE:A resin composition which is suitable for use as an impregnating varnish in manufacturing a laminate material for a circuit board, and contains a prepolymer of an isocyanurate compound and a cyclized polybutadiene. CONSTITUTION:A prepolymer (A) of a compound of formula I or II [where R1- R3 each are H or an organic group (at least two of R1-R3 are organic groups containing polymerizable unsaturated groups)] (e.g. triallyl isocyanurate) and a cyclized butadiene polymer (B) in a proportion of about 3:7-7:3 are dissolved in an organic solvent (e.g. xylene). A radical initiator (C) in an amount of about 0.1-10pts.wt. based on 100pts.wt. resin composition is added to the obtained mixed varnish to give an impregnating varnish. In place of the prepolymer A in the above-mentioned composition, a precopolyer of a compound of formula I (or formula II) and a compound of formula III [where R4 and R5 each are H or an organic group (at least one of R4 and R5 is an organic group containing polymerizable unsaturated groups)] can be used to reduce moderately the rate of crosslinking reaction in curing.</p>
申请公布号 JPS6128545(A) 申请公布日期 1986.02.08
申请号 JP19840147628 申请日期 1984.07.18
申请人 HITACHI LTD 发明人 NAGAI AKIRA;TAKAHASHI AKIO;SUGAWARA TOSHIO;ONO MASAHIRO;TADA RITSURO;WAJIMA MOTOYO;NARAHARA TOSHIKAZU
分类号 C08L29/00;B29C70/06;B29L9/00;B32B27/04;B32B37/00;C08J5/04;C08J5/24;C08L7/00;C08L15/00;C08L21/00;C08L29/04;C08L29/10;C08L33/00;C08L33/02;C08L39/00;C08L39/04;C08L47/00;H05K1/03 主分类号 C08L29/00
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