发明名称 MANUFACTURE OF ELECTRONIC PARTS
摘要 <p>PURPOSE:To equally form the length of tips of lead wires protruding from the rear side of a printed board by a method wherein, after resin has been coated, the mounting resin is hardened, the excision of the tip part of the dripped resin of the base part of the lead wire and the cutting of the tip part are conducted simultaneously by making equal the intervals between the excited parts and also between the cut parts. CONSTITUTION:After a thermosetting process has been completed, the resin at the base part of lead wires 2 becomes resin 3B by the setting. Said lead wires 2 are fitted to the part between the fixed part 10A and the moving part 10B of a cutting tool 10, the moving part 10B is shifted, and the cutting operation of the dripped resin 3B' and the lead wire 2 are conducted. The fixed part 10A and the moving part 10B have a fine blade-shaped projection on the part surrounding the lead wires 2. Cut parts 11 having certain lengths in the longitudinal direction are provided. At the same time, a cutting blade 12 is provided on the part surrounding the tip parts of the lead wires 2, said tip parts are cut, the dripped resin 3B' is broken by the edge of the blade, and an electronic part is pulled out upward. As a result, the exposed length of the lead wires 2 from the tip of the dripped resin 3B to the tip of the lead wires 2 exactly becomes the value of the H determined by the cutting tool 10.</p>
申请公布号 JPH01232703(A) 申请公布日期 1989.09.18
申请号 JP19880058188 申请日期 1988.03.14
申请人 NITSUKO CORP 发明人 TANAKA NORIO
分类号 H01C17/00;H01C17/02;H01G13/00 主分类号 H01C17/00
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