发明名称 METHOD FOR FORMING OXIDE COVER FILM TO COPPER OR COPPER ALLOY
摘要 PURPOSE:To form oxide cover film superior in adhesive property, wear resistance, electrical insulating property with uniform thickness on the surface, by dipping Cu or Cu alloy in water contg. oxygen and specified surfactant. CONSTITUTION:Material to be treated of a part of Cu or Cu alloy, e.g. cu strand wire, etc. is put in tank, inner part of tank is exhausted, then water is poured therein. Next, cathion surfactant such as quartenary ammonium salt, or nonion surfactant such as polyoxyethylene alkylether or the like is added to about 10ppm concn. Further, oxygen is dissolved in water under gas phases system of >=0.4kg/cm<2> oxygen partial pressure, and temp. is controlled to 60-200 deg.C. On this state, the oxide cover film superior in wear resistance, electrical insulating and adhesive properties is formed over whole strand Cu wire and also sufficiently to the gaps.
申请公布号 JPS6126782(A) 申请公布日期 1986.02.06
申请号 JP19840149100 申请日期 1984.07.17
申请人 SUMITOMO ELECTRIC IND LTD 发明人 TAKANO SATORU
分类号 C23C22/00;C23C22/68;H01B13/16 主分类号 C23C22/00
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