| 摘要 |
PURPOSE:To facilitate the trimming of the resistor of the lower circuit layer by a method wherein the interlayer insulation layer at the part opposed to the part of trimming of the lower circuit layer is formed thinly in manufacture of the titled substrate. CONSTITUTION:The lower layer wiring conductors 28 and 29 and the lower layer resistor 30 are formed on an insulation substrate 27 of alumina or the like. Next, interlayer insulation layers 32 and 33 are formed, and the upper wiring conductors 35, 36, and 37 and the upper layer resistor 38 are formed on the insulation layer 33. At this time, the part of the insulation layer 33 opposed to the part of trimming of the lower resistor 30 is provided with an aperture 34, and the insulation layer is thinned at this part. Then, the laser output does not have to be much increased in trimming 40 to the lower layer resistor 30, and trimming is facilitated; besides, its time is saved. Since the lower layer resistor 30 can be subjected to trimming after calcination of the upper layer circuits, the resistance value of the lower layer resistor 30 can be accurately set. |
