发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To form a permanent protective film rich in storage stability, hardenable by heating for a short time by using a compsn. consisting of a specified photopolymerizable unsatd. compd., a photopolymn, sensitizer, a polymer, and a compd. having an amineimide group. CONSTITUTION:The compsn. consists of, or essentially of a) a photopolymerizable unsatd. compd. having at least 2 terminal ethylenic groups; b) a photopolymerizable sensitizer; c) a polymer having structural units each having OH; and d) a compd. having at least 2 amineimide groups in one molecule. The d) component is, preferably, represented by formula ( I ) in which R1-R4 are each an aliphatic or aromatic hydrocarbon optionally substd. by O, S, or N, and n is, preferably, >=2. The photosensitive layer made of such a compsn. formed on a base is imagewise exposed to actinic rays, and developed by dissolving off the unexposed areas. The obtained image serves as corrosion-resistance film for surface modification, such as plating, and can be formed into a permanent protective film superior in heat resistance and mechanical strength by heating it for a short time. It can be used for a protective film, such as a solder resist, and further for a plastic relief and a printing plate, because of high sensitivity and high chemical and physical strengths.
申请公布号 JPS6125139(A) 申请公布日期 1986.02.04
申请号 JP19840146627 申请日期 1984.07.13
申请人 SEKISUI CHEM CO LTD 发明人 YANAGISAWA KUNIO;ARAKI YASUHIKO;SHIYOUBI HAJIME
分类号 G03F7/004;C08F2/48;C08F2/50;C08F246/00;C08F265/04;G03F7/033;G03F7/085 主分类号 G03F7/004
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