发明名称 MOLDING OF RESIN
摘要 PURPOSE:To prepare a molded piece equal in film thickness by absorbing resin powder in a gas permeable mold. CONSTITUTION:Air is introduced into the fluid tank 5 through the fluid plate 7 to fluidize resin powder 4. The mold 2 is heated by the induction heating coil 8. When the valve 9 mounted on the reserver 10 is opened after a desired temperature is obtained, the resin powder 4 is absorbed from the fluidized tank 5, stuck to the mold surface 2 and fused at the same time. When the gas-permeability of the mold 2 is lost by the melted resin film 12, the valve 9 is closed. After cooling, the molded piece is taken out of the mold 2. The resin film 12 is made by absorption of a necessary amount of resin powder 4 to obtain the molded piece free from heat deterioration and uniform in film thickness.
申请公布号 JPS6120716(A) 申请公布日期 1986.01.29
申请号 JP19840142532 申请日期 1984.07.10
申请人 TOYOTA JIDOSHA KK 发明人 IMAO EIICHI
分类号 B29C41/02;B29C41/08;B29C41/36;B29K27/06;B29L22/00 主分类号 B29C41/02
代理机构 代理人
主权项
地址