Process and apparatus for producing filled wafer blocks

摘要

In a process in which cover sheets and/or coated wafer sheets are joined to form filled wafer blocks, each coated wafer sheet and, if desired, each cover sheet is moved in a stacking location from a lower position to an overlying upper position, the coated upper surface of each coated wafer sheet is joined to the underside of the cover sheet which is in the upper position and which, if desired, has previously been raised to the upper position, or to the underside of the coated wafer sheet which has previously been raised to the upper position, and each complete wafer block consisting of at least two sheets is moved from said upper position out of said stacking location. To increase the production rate, it is proposed that the successive coated wafer sheets for each wafer block or successive coated wafer sheets and cover sheets disposed between successive coated wafer sheets are successively and continuously fed one by one to the lower position in the stacking location, and at least part of the movement of each of said sheets to said lower position is performed while the next preceding sheet is being raised. It is also proposed to carry out the process by means of two helical conveyors, which have parallel axes of rotation, which are inclined from a normal on the plane of conveyance of the wafer sheet feeder and each of which has a lower convolution, an upper convolution, and an inclined step joining said upper and lower convolutions.