| 摘要 |
PURPOSE:To improve characteristics such as damp-proofing of a device by utilizing each characteristic of sealing resins of two kinds or more, and to enhance damp-proofing by a metallic cap by using the resins of two kinds as a resin seal type semiconductor and forming the metallic cap to a resin seal surface. CONSTITUTION:A semiconductor chip 4 is mounted onto one surface of a resin board 3 made of glass-epoxy by a bonding agent having a low thermal expansion coefficient 5. There is a wiring pattern with the exception of a mounting section for the semiconductor chip 4, and there are bonding pads around the mounting section. A resin frame 2 is bonded with the periphery of the bonding pads by a thermo-setting resin having a low thermal expansion coefficient and excellent damp-proofing. Bonding wires 6 are coated with a thermo-setting sealing resin 1' having a thermal expansion coefficient within a range that the bonding wires are not cut by a temperature cycle, and the upper section of the sealing resin 1' and the inside of the resin frame 2 are bonded by a thermo-setting sealing resin 1 having superior damp-proofing. A metallic cap 9 is shaped onto the sealing resin 1. |
