| 摘要 |
PURPOSE:To attain to uniformize the film thickness distribution and step coverage distribution in a substrate, by arranging a sputtering target and the substrate in non-parallel and opposed relation to each other and rotating the substrate around the rotary shaft crossing the surface of said substrate at right angles. CONSTITUTION:A sputtering apparatus is constituted by arranging one sputtering target and a substrate 2, which rotates around the rotary shaft 50 crossing the surface thereof at right angles, in non-parallel and opposed relation to each other. The aforementioned substrate is coated with sputtering atoms flying from the target 1. The perpendicular line 4 erected on the surface of the target 1 from the center thereof crosses the surface of the substrate 2 performing rotary motion. By this apparatus, the film thickness distribution and step coverage distribution in the substrate are uniformized. |
