| 摘要 |
PURPOSE:To conduct uniform etching and obtain a pattern on the entire part of wafer of uniform dimension by rotatably providing a wafer setting pedestal on a lower electrode and rotating such wafer setting pedestal together with lower electrode about a rotating axis of lower electrode. CONSTITUTION:A disk type lower electrode 52 is provided at the lower part at the inside of an etching chamber 51 and a gear 52 is provided at the upper part of such lower electrode 52. These lower electrode 52 and gear 53 are settled to a shaft 55 of a motor 54 provided at the lower part of the etching chamber 51 and simultaneously rotate. At the lower electrode 52, a plurality of wafer setting pedestals, for example, two pedestals 56, 56 are arranged at the circumference of the gear 53. These wafer setting pedestals 56, 56 are made of disk type metal, the external circumferences of them are formed like gears and are engaged with said gear 53. Therefore, the wafer setting pedestal 56, 56 rotate around the shaft 55 together with the lower electrode 52 when the shaft 55 of motor 54 rotates. Simultaneously these rotate by themselves around a hole 58 of the lower electrode 52 when a rotating force of gear 53 is transferred. Namely the these pedestals rotate by themselves and also revolve for the center of lower electrode 52. |
