发明名称 DISPLAY DEVICE FOR PLATING FILM THICKNESS
摘要 PURPOSE:To judge the end point of time of plating operation securely by displaying the current film thickness sequentially during the plating operation on the basis of electric energy as the product of a current applied to a plated body and time and the area of the plated body. CONSTITUTION:The area of the plated body 3 from a plating film thickness calculating means 8 is inputted from a plated body area input device 7 during plating operation and the area value is inputted to a CPU10 through an input circuit 14 and stored in a memory 1. A reset signal is sent to an integrating watt meter 6 through an output circuit A13 from a CPU10 so as to reset the integrated electric power of the integrating watt meter 6, and the integrated electric power is reset. When the input operation of the area is completed, an operator sets the body 3 to be plated in a plating tank 1 and a current corresponding to the body 3 to be plated is flowed. Then, the film thickness obtained by a film thickness calculating means 8 is displayed on a display device 9 and the plating operation is completed with specific plating film thickness.
申请公布号 JPS6111649(A) 申请公布日期 1986.01.20
申请号 JP19840132612 申请日期 1984.06.27
申请人 MITSUBISHI DENKI KK 发明人 SOMURA MASAO
分类号 G01N27/26;C23C2/14;G01B7/06 主分类号 G01N27/26
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