| 摘要 |
PURPOSE:To make it possible to perform airtight sealing and to improve the reliability of a semiconductor product, by controlling the increase in inner pressure of a cap by an upper hole, hardening a resin at the peripheral part of a substrate, then sealing the upper hole by the resin. CONSTITUTION:Under the state a pin 13 having a valve is inserted in an upper hole from the inside of a cap 7 beforehand, the cap 7 is mounted on a substrate 2. A bonding resin 8 is applied on the inside of a lower hole 6 of the cap beforehand. Under the state a lead 4 is surrounded by the lower hole 6, the peripheral part of the cap 7 is heated to 100-200 deg.C and the resin 8 is hardened. Thus the cap 7 is bonded to the substrate 2. When the hardening of the resin 8 at the peripheral part of the cap 7 is finished, the pin 13 is lifted. The cap 7 and the pin 13 or the valve 12, which is provided on the pin 13, are bonded by a bonding agent and the like under a normal temperature. Thereafter, the pin 13, which is protruded to the outside, is broken. The upper hole 11 of the cap is filled by a blinding resin 14, and the resin is heated and hardened. |
