PROVIDING ELECTRICAL CONNECTIONS TO PLANAR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS

摘要

Grounding of source contacts (S) of flat devices and integrated circuits (of the FET type) is carried out according to the following process steps: a GaAs wafer is applied on a support and is covered on its free or rear face with photoresist; the latter is then etched along the border lines of the single FETs; the GaAs layer between contiguous FETs is removed also to make accessible the contacts S; a layer of noble metal is then deposited on the FET rear faces, so that it bridges the contacts S; the single metallized devices are disconnected from the initial support and finally are soldered to a package base.