| 摘要 |
<p>A substrate is provided with through holes each of which receives a heat sink. The heat sinks all project from one side of the substrate and are secured to that side of the substrate by means of flange members which are bonded to the heat sinks and the substrate. Cooling fins are provided on -the protruding portion of each heat sink. That end of each heat sink which is received within a hole supports an integrated circuit chip which is bonded directly to the heat sink end and is substantially flush with the other side of the substrate. The chip is electrically connected to the other side of the substrate. The direct connection of the chips to the heat sinks avoids the thermal resistance of the substrate.</p> |
