| 摘要 |
<p>PURPOSE:To mount a semiconductor element securely while preventing any crack or breakage due to thermal stress from happening while making the element operate normally and stably for a long time by a method wherein a section placing or containing the semiconductor element is composed of silicon nitride sintered body with thermal expansion coefficient similar to that of the semiconductor element. CONSTITUTION:A sludge comprising silicon nitride powder added with sintering assistant and bonding agent is formed into a sheet. Within such a sheet, an empty space to form a cavity 4 containing semiconductor element 2 as well as a leading hole to lead a conductive pattern 5 from the cavity 4 on a base 3 to the bottom of base 3 are formed and then a conductive pattern 5 to connect the surface of sheet formed of the leading hole and the conductive hole to the semiconductor element 2 and external lead terminals 6 is formed. Next the sheet is laminated to hold the conductive pattern 5 formed on the surface between itself being fixed by thermal pressure to be cut and separated into multiple pairs of packages 1 and further baked to sinter into one body. Finally the external lead terminals 6 made of Koval, etc. are brazed using silver wax material, etc.</p> |
