| 摘要 |
PURPOSE:To prevent the deterioration of the photoelectric conversion factor by making use of a part which does not contribute to the photoelectric conversion and to decrease the size of a chip form, by forming a reception circuit at a shadow part of a light emitting element, etc. to a photodetecting element. CONSTITUTION:A light emitting element LED2 and a photodiode PD3 serving as a photodetecting element are die-bonded to plate parts 4a and 5a of lead frames 4 and 5 respectively. The LED2 is laminated at the front of the PD3. A lead part 4b is extended to the part 4a, and a power supply lead frame 10 and an output lead frame 11 are provided adjacently to a lead part 4b. While an anode lead frame 7 is set symmetrically to the frame 5. A shadow part 12 is formed by both frames 5 and 7, and a reception circuit 9 is provided at the part 12. Thus the size of the PD3 is never increased with no reduction of its photodetecting area. |
