Semiconductor package substrate and manufacturing process.

摘要

A multilayer ceramic substrate (20) has on its surface contact pads formed in indentations (24) which are interspersed between the matrix of vias and connected by indented lines to vias (26) at the periphery of the matrix. The indentations and the pattern of indented lines (40) are formed in the surface of a green ceramic substrate, the lines filled with a conductive metal paste, and a layer (50) of dielectric green ceramic material deposited over at least a portion of the area of the pattern of indented lines. The resultant substrate is then sintered.