| 摘要 |
PURPOSE:To obtain a mounting system applying a bonding material smoothly in a full-automatic manner by a constitution wherein informations obtained by picking up by a camera set on a supply head are collated with standards to calculate positional deviations and the head is driven to a proper position so as to supply the bonding material. CONSTITUTION:When circuit boards 21 and 22 get from a magazine 2 to positions under a supply head 5 installed on an X-Y table 26, marks 23 and 24 are picked up by a TV camera 6, subjected to image processing 30 and then inputted to CPU28, wherein they are collated with standards to calculate deviations. Based on this calculation, the head 5 is moved to a proper position, and Ag paste is injected to drip from a needle 26 positioned at the end of a cylinder 25, by controlling a solenoid-operated valve 29. According to this construction, the Ag paste can be supplied onto the boards in a successive and full-automatic manner, and the productivity is further improved to a great extent by incorporating a chip fitting process also into the same process.
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