| 摘要 |
A process and apparatus for sealing electronic packages and lids involves placing a heater preform device between the sealing surfaces of the package and lid. If the package and lid are ceramic, the preform may be metallic having a glass coating fused thereto. Similar glass coatings would be fused to the sealing surfaces of the package and lid. The metallic portion of the preform is then heated by, for example, passing an electrical current therethrough to melt the glass and effect the seal.
|
