| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive cover lay film with a sufficient mechanical strength, superior heat resistibility, good workability and superior adhesive property, which reduces little warp at the time of being pasted together with a flexible print board. SOLUTION: The photosensitive cover lay film can be laminated at a temp of 150 deg.C or lower and directly laminated on the print board without an adhesive, and has photosensitivity, a heat decomposition initiating temperature of 300 deg.C or higher after hardening, an elastic modules of 100-3,000 N/mm2 after hardening and a hardening temperature of 200 deg.C or lower, and includes a soluble polymide using imido siloxanediamine. |
