| 摘要 |
PURPOSE:To prevent disconnection of wiring patterns at the time of soldering for lead terminals by providing a slit to each electrode conductive terminal. CONSTITUTION:The leadout part 6a of wiring pattern 6 formed on an anode substrate 2 corresponding to each electrode and electrode conductive terminal 7 are guided to the outside of vacuum case and a slit 20 is provided to each electrode conductive terminal 7. Since the solder area of each electrode conductive terminal 7 is small and amount of solder to be placed is reduced at the time of soldering the lead terminals, concentration of soldered area during the cooling process by temperature drop after the solder dip is small and strain is also small, disconnection by crack generated on the wiring pattern can be prevented. Moreover, since each electrode conductive terminal 7 is plitted at the slit portion 20, if crack 30 is generated at a local area of the one piece, continuity can be assured with the other piece. |
