| 摘要 |
PURPOSE:To increase the number of semiconductors to be placed on a wafer by a method wherein a pin comes down when the bottom plate is lowered, the pin is shifted to the center direction of the wafer following the above-mentioned operation, and the center of the wafer is brought in line with the prescribed position by pressing the wafer from its side. CONSTITUTION:The pin 8 fied to a bottom plate 6 has a small diameter part having a spring function and a large diameter part having a cum function. When a fixing mechanism is opened by lifting up the bottom plate, the large diameter part of the pin 8 comes in contact with a plate 1 and it is opened to the outside. When a wafer 3 is placed on the pin 8 under the above-mentioned state, the wafer 3 is within the range of horizontal looseness on the tip part of the pin 8. Then, when the bottom plate comes down, the wafer 3 is brought in the state wherein it is moved to the plate 1. At this time, as the large diameter part of the pin 8 comes off the hole of the plate 1, the wafer 3 is pushed out from the side face and brought in the state wherein a centering is performed. Besides, when the bottom plate 6 comes down, the wafer 3 is fixed by the force of spring, and the looseness is reduced mechanically, thereby enabling to perform a centering.
|
