| 摘要 |
PURPOSE:To improve the bonding strength of a plate film by mking the surface of a material to be plated microporous and carrying out plating along the surface to be plated so that the micropores are completely filled with the desired metal. CONSTITUTION:The surface of a material 2 to be plated is made microporous 3 to 5-20mum depth by strong chemical etching, and a plated film 1 is formed by carrying out plating at 100-500A/dm<2> high current density while passing a plating soln. along the surface to be plated at 0.5-15m/sec high flow rate so that the micropores 3 are completely filled with the desired metal. The plated film 1 and the metal 4 electrodeposited in the micropores 3 are metallurgically united to one body, so the film 1 and the material 2 are firmly joined together.
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