POSITION ALIGNING METHOD OF SEMICONDUCTOR CHIP

摘要

PURPOSE:To perform the alignment of a light receiving chip and a transfer chip of a CCD and the like accurately, by forming position aligning marks comprising impurity diffused layers, which can be observed by near infrared rays in the initial process of the semiconductor manufacturing processes. CONSTITUTION:A light receiving chip 11 is provided with light receiving elements 15 on the surface of a substrate comprising InSb and electrodes 17 comprising In on the elements 15. A position aligning mark 19 is formed on the surface of the substrate 11 by a metallic evaporation film of Al and the like. Near infrared rays are projected from the back side of a transfer chip 1 and reflected by position aligning marks 5 of impurity diffused layers. The infrared rays are also reflected by the position aligning mark 19 of the metallic evaporation film on the surface of the substrate 11 of InSb. The reflected light 302 is inputted to an irradiation detecting part 300. Upper and lower stages 100 and 200 are moved in the lateral direction. Thus the position alignment can be performed readily.