发明名称 POLYPHENYLENE ETHER COMPOSITION HAVING IMPROVED MOLDABILITY
摘要 PURPOSE:To obtain the titled composition having improved fluidity while suppressing the lowering of heat-resistance, by compounding a triamide compound to a composition composed mainly of polyphenylene ether. CONSTITUTION:The objective composition can be prepared by compounding (A) a composition composed mainly of 100pts.(wt.) of a polyphenylene ether [e.g. poly(2,6-dimethyl-1,4-phenylene)ether] and 0-2,000pts. of a styrene resin with (B) 0.1-25pts., especially 2-10pts. (based on 100pts. of the whole polymer) of a triamide compound of formula I or formula II (R<1> is 1-20C, and R<2>, R<3> and R<4> are 1-10C straight or branched saturated or unsaturated chain hydrocarbon residue, alicyclic hydrocarbon residue, aromatic hydrocarbon residue, or residure of these derivative). The triamide compound dissolves in the matrix component in molding and crystallizes in use to effect the phase-separation from the matrix component. The melting point of the triamide compound is preferably somewhat lower than the molding temperature, usually 150-300 deg.C.
申请公布号 JPS60252655(A) 申请公布日期 1985.12.13
申请号 JP19840108140 申请日期 1984.05.28
申请人 MITSUBISHI YUKA KK 发明人 TAMURA YUTAKA
分类号 C08K5/20;C08K5/17;C08L7/00;C08L21/00;C08L23/00;C08L25/00;C08L25/04;C08L33/00;C08L33/02;C08L51/00;C08L51/02;C08L71/00;C08L71/12;C08L77/00;C08L101/00 主分类号 C08K5/20
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