发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a damage on the upper surface of a light transmission cap by bonding a light transmission film through an Si adhesive on the upper surface of the cap. CONSTITUTION:A polyester film 6 having good light transmission is bonded to the outer surface of a BSG cap 4 without colorant with Si adhesive 7 having good light transmission. Thus, it can prevent the surface of the BSG4 from damaging, and the cap passing light is not disturbed linearly to accurately collect an image to a CCD element 2. When the adhesive 7 is coated only the peripheral edge and bonded, the bonding strength of the film is deteriorated, but Si adhesive having insufficient light transmission can be used.
申请公布号 JPS60250653(A) 申请公布日期 1985.12.11
申请号 JP19840105732 申请日期 1984.05.25
申请人 NIPPON DENKI KK 发明人 TERAJIMA KATSUSHI
分类号 H01L23/06;H01L27/14;H01L31/0203 主分类号 H01L23/06
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